Cap package for micro electro-mechanical system
A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 O...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 Omegam. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate. |
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