Method for increasing wiring channels/density under dense via fields

A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball grid array (BGA) makes contact on...

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Bibliographische Detailangaben
Hauptverfasser:	HARIDASS ANAND, THOMKE GISBERT GERHARD, KLINK ERICH, KALLER DIERK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball grid array (BGA) makes contact only on the surface pads of the printed circuit board with no plated through holes/vias underneath these surface pads. This opens up wiring channels, which previously used to be occupied by plated through holes and anti-pads, that can now be used for maximizing signal line wiring routing.