Method for locating flaws, and a marking system

In the method for locating flaws on the surface of a three-dimensional object the flaws are detected and located using one or more optical image-taking device. When a picture is taken showing a flaw the location of the flaw on the object is determined with great accuracy from the design data for the...

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Bibliographische Detailangaben
Hauptverfasser:	ERSUE ENIS, KNOCHE HORST, WIENAND STEPHAN
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING
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Beschreibung
Zusammenfassung:	In the method for locating flaws on the surface of a three-dimensional object the flaws are detected and located using one or more optical image-taking device. When a picture is taken showing a flaw the location of the flaw on the object is determined with great accuracy from the design data for the object, the optical imaging properties of the optical image-taking device, and the positions of the optical image-taking device and the object. A marking system for marking the position of the flaws on the object, which are detected by the method, is also described, which includes plural marking heads and displacement devices for positioning and/or activating the marking heads independently of each other.