Interconnect structure and process of making the same

A method of forming an interconnect structure in an inter-layer dielectric (ILD) material, the method include the steps of creating one or more via openings in the ILD material; forming a first liner covering at least one of the one or more via openings; creating one or more trench openings on top o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FITZSIMMONS JOHN ANTHONY, STANDAERT THEODORUS EDUARDUS, KO TZE-MAN, SANKARAN SUJATHA, LUSTIG NAFTALI ELIAHU, DAVIS PEGEEN M, NICHOLSON LEE MATTHEW, GRECO STEPHEN EDWARD
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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