Probe interposers and methods of fabricating probe interposers
The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe ti...
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| creator | CRUMP BRETT MCBRIDE JERRY CALDWELL JOHN BYRD PHIL |
| description | The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication. |
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In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication.</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081202&DB=EPODOC&CC=US&NR=7459923B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081202&DB=EPODOC&CC=US&NR=7459923B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CRUMP BRETT</creatorcontrib><creatorcontrib>MCBRIDE JERRY</creatorcontrib><creatorcontrib>CALDWELL JOHN</creatorcontrib><creatorcontrib>BYRD PHIL</creatorcontrib><title>Probe interposers and methods of fabricating probe interposers</title><description>The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALKMpPSlXIzCtJLSrIL04tKlZIzEtRyE0tychPKVbIT1NIS0wqykxOLMnMS1coQFfMw8CalphTnMoLpbkZFNxcQ5w9dFML8uNTiwsSk1PzUkviQ4PNTUwtLY2MnYyMiVACADRCMOc</recordid><startdate>20081202</startdate><enddate>20081202</enddate><creator>CRUMP BRETT</creator><creator>MCBRIDE JERRY</creator><creator>CALDWELL JOHN</creator><creator>BYRD PHIL</creator><scope>EVB</scope></search><sort><creationdate>20081202</creationdate><title>Probe interposers and methods of fabricating probe interposers</title><author>CRUMP BRETT ; MCBRIDE JERRY ; CALDWELL JOHN ; BYRD PHIL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7459923B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CRUMP BRETT</creatorcontrib><creatorcontrib>MCBRIDE JERRY</creatorcontrib><creatorcontrib>CALDWELL JOHN</creatorcontrib><creatorcontrib>BYRD PHIL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CRUMP BRETT</au><au>MCBRIDE JERRY</au><au>CALDWELL JOHN</au><au>BYRD PHIL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Probe interposers and methods of fabricating probe interposers</title><date>2008-12-02</date><risdate>2008</risdate><abstract>The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | Probe interposers and methods of fabricating probe interposers |
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