Probe interposers and methods of fabricating probe interposers

The invention includes probe interposers and methods of fabricating pose interposers. In one implementation, a method of fabricating a probe interposer includes providing a substrate having a frontside and a backside. Probe tips are lithographically patterned on the substrate frontside. The probe tips have electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed. Mechanical hard stops are lithographically patterned on the substrate frontside. The mechanical hard stops have outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer. The invention includes probe interposers independent of method of fabrication.