High speed switching module comprised of stacked layers incorporating t-connect structures

A compact multi-stage switching network ( 100 ), and a router ( 510 ) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports ( 110 ) to selected ones of a second plurality of output ports ( 190 ) comprisi...

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Bibliographische Detailangaben
Hauptverfasser: OZGUZ VOLKAN H, CARSON JOHN C
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A compact multi-stage switching network ( 100 ), and a router ( 510 ) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports ( 110 ) to selected ones of a second plurality of output ports ( 190 ) comprising: a first stack ( 140 ) of IC switching layers ( 113 ) that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit ( 142 ); a second stack ( 160 ) of IC switching layers ( 113 ) that are stacked in physical contact with one another, each IC switching layer ( 113 ) containing at least one switching element circuit ( 162 ); and interconnecting circuitry ( 150 ) that connects the first stack ( 140 ) of IC layers to the second stack ( 160 ) of IC layers to form the compact multi-stage switching network. The stacks ( 140, 160 ) are preferably mated to one another in a transverse fashion in order to achieve a natural full-mesh connection. Also contemplated are the use of superconducting IC switching circuits ( 142 ) and a suitable superconducting cooling housing ( 730 ), as permitted by the compact nature of the multi-stage switching network ( 100 ), in order to operate at high speed and low power.