Heat dissipating apparatus

A heat dissipating apparatus ( 10 ) includes a base ( 20 ), a plurality of stacked fins ( 30 ), and at least a heat pipe ( 40 ). The base absorbs heat from a heat-generating component. Each of the fins includes a main body ( 32 ), and a plurality of projection members ( 33 ) extending from the main...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIN TONG-HUA, LIN YEU-LIH, CHEN CHIN-LUNG, CHOU DAANG
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat dissipating apparatus ( 10 ) includes a base ( 20 ), a plurality of stacked fins ( 30 ), and at least a heat pipe ( 40 ). The base absorbs heat from a heat-generating component. Each of the fins includes a main body ( 32 ), and a plurality of projection members ( 33 ) extending from the main body. The projection members of a first fin connect the projection members of a second fin. The projection members form a first heat transfer path for transferring heat from the base to the fins. The heat pipe includes a heat-absorbing portion ( 42 ) thermally contacting with the base, and a heat-dissipating portion ( 44 ) contacting with the fins. The heat pipe forms a second heat transfer path for transferring the heat from the base toward the fins.