Film peeling method and film peeling device

Film peeling method and film peeling device

A film peeling device for peeling a film which has been stuck onto a film sticking face of a wafer including: a wafer sucking means for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means for feeding a peeling tape onto the film of the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: AMETANI MINORU
Format: Patent
Sprache:eng
Schlagworte:
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:A film peeling device for peeling a film which has been stuck onto a film sticking face of a wafer including: a wafer sucking means for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means for feeding a peeling tape onto the film of the film sticking face; a pushing means for pushing only one portion of the peeling tape against the film at an edge portion of the wafer so that the adhesive strength between the peeling tape and the film can be enhanced in the one portion of the peeling tape; and a peeling means for peeling the film from the film sticking face of the wafer by the peeling tape while the one portion of the peeling tape, the adhesive strength of which has been enhanced, is used as a peeling start portion.