Non-volatile memory device and method of fabricating the same

A method of fabricating an a non-volatile memory includes forming trench isolation regions in an inactive region of a semiconductor substrate, adjacent trench isolation regions defining respective protrusions having rounded edges therebetween, wherein upper surfaces of the trench isolation regions are lower than an upper surface of the semiconductor substrate and wherein the protrusions define an active region, forming a tunnel insulating layer covering the protrusion of the semiconductor substrate, and forming, sequentially, a storage layer, a blocking insulating layer, and a gate layer covering the tunnel insulating layer.