Micromechanical capacitive acceleration sensor

A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure ( 110 ), a sensor inertia mass ( 101 ) made of a wafer and movably mounted relative to the frame structure ( 110 ) about a rotat...

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Bibliographische Detailangaben
Hauptverfasser: SEIDEL HELMUT, TOELG SEBASTIAN, KNITTL PETER, WEINACHT MANFRED, PRECHTEL ULRICH, KAPSER KONRAD
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure ( 110 ), a sensor inertia mass ( 101 ) made of a wafer and movably mounted relative to the frame structure ( 110 ) about a rotation axis, and a capacitive pick-up unit ( 120 ) for producing at least one capacitive output signal representing the position of the sensor mass ( 101 ) relative to the frame structure ( 110 ). The sensor inertia mass ( 101 ) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass ( 101 ) and the frame structure ( 110 ) are made monolithically of one single crystal silicon wafer. A cover section ( 112 ) forms a common connector plane ( 150 ) for the connection of capacitor electrodes ( 125,126 ). Torqueable elements ( 105 ) form an electrically conducting bearing device for the sensor mass ( 101 ).