Connector terminal fabrication process and connector terminal

An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUOKA KATSUMASA, KATO YOSHIAKI, SASAKI HAREHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LINE CONNECTORS TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral surfaces of which have been subjected to a plating treatment beforehand, are employed. End portions of the first wire member and the second wire member are mutually superposed, and the first wire member and the second wire member are joined. Thus, the fitting portion is formed and the board attachment portion is formed. Hence, a surface of the upper tier terminal is structured by a plating layer at the peripheral surface of the first wire member and a plating layer at the peripheral surface of the second wire member. Consequently, a post-plating treatment can be rendered unnecessary.