Apparatus for mechanically bonding and cutting an article

In apparatus for mechanically bonding and cutting an article during assembly thereof at least a portion of the article is transported through a nip defined by first and second members. A bonding segment is disposed on one of the first and second members and a cutting segment separate from the bondin...

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Bibliographische Detailangaben
1. Verfasser:	VAN EPEREN DAVID J
Format:	Patent
Sprache:	eng
Schlagworte:	BANDAGES, DRESSINGS OR ABSORBENT PADS DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS FILTERS IMPLANTABLE INTO BLOOD VESSELS FIRST-AID KITS FOMENTATION HUMAN NECESSITIES HYGIENE LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MEDICAL OR VETERINARY SCIENCE ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES PERFORMING OPERATIONS PROSTHESES TRANSPORTING TREATMENT OR PROTECTION OF EYES OR EARS
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Beschreibung
Zusammenfassung:	In apparatus for mechanically bonding and cutting an article during assembly thereof at least a portion of the article is transported through a nip defined by first and second members. A bonding segment is disposed on one of the first and second members and a cutting segment separate from the bonding segment is also disposed on one of the first and second members. The apparatus is operable so that a portion of the article is mechanically bonded as the article passes through the nip and a portion of the article separate from the bonded portion is cut as the article passes through the nip.