Method of manipulating wafers

A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BUSSE KARL-HERMANN, ARLT JOACHIM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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