Method of manipulating wafers

Method of manipulating wafers

A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electro...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BUSSE KARL-HERMANN, ARLT JOACHIM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electrostatic carrier for the duration of and between at least two processing steps, during the manipulating steps and during any necessary intermediate storage.