Method of manipulating wafers
A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electro...
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| creator | BUSSE KARL-HERMANN ARLT JOACHIM |
| description | A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electrostatic carrier for the duration of and between at least two processing steps, during the manipulating steps and during any necessary intermediate storage. |
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The wafers remain on the transportable electrostatic carrier for the duration of and between at least two processing steps, during the manipulating steps and during any necessary intermediate storage.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080226&DB=EPODOC&CC=US&NR=7336015B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080226&DB=EPODOC&CC=US&NR=7336015B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BUSSE KARL-HERMANN</creatorcontrib><creatorcontrib>ARLT JOACHIM</creatorcontrib><title>Method of manipulating wafers</title><description>A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. The wafers remain on the transportable electrostatic carrier for the duration of and between at least two processing steps, during the manipulating steps and during any necessary intermediate storage.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD1TS3JyE9RyE9TyE3MyywozUksycxLVyhPTEstKuZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwebGxmYGhqZORsZEKAEAjqAj7w</recordid><startdate>20080226</startdate><enddate>20080226</enddate><creator>BUSSE KARL-HERMANN</creator><creator>ARLT JOACHIM</creator><scope>EVB</scope></search><sort><creationdate>20080226</creationdate><title>Method of manipulating wafers</title><author>BUSSE KARL-HERMANN ; ARLT JOACHIM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7336015B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BUSSE KARL-HERMANN</creatorcontrib><creatorcontrib>ARLT JOACHIM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BUSSE KARL-HERMANN</au><au>ARLT JOACHIM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of manipulating wafers</title><date>2008-02-26</date><risdate>2008</risdate><abstract>A method of manipulating preferable thin wafers, preferably having a thickness of less than 200 mum, wherein the wafers are placed prior to polishing or another processing step for reducing the thickness thereof on a transportable electrostatic carrier. 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| subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES |
| title | Method of manipulating wafers |
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