Supporting device of a transport device of a soldering apparatus

The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends of the transport zone, wherein, for adaptation to the width of the respective printed-circuit boards, the guide elements are mounted on a carrier such as to be displaccable transverse to the conveying direction. The guide elements, each associated with a respective conveying chain, are interconnected by flexible tension elements, said tension elements being adjustable with regard to their tensile stress and running parallel to the respective conveying chain in the transport zone, the value of the tensile stress being so highly adjusted that the tension elements prevent the guide rails from deviating from a straight line.