Method for encapsulating multiple integrated circuits

A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first encapsulation structure. A second i...

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Bibliographische Detailangaben
1. Verfasser:	ZHOU TIAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TESTING
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