Method for encapsulating multiple integrated circuits

Method for encapsulating multiple integrated circuits

A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first encapsulation structure. A second i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ZHOU TIAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first encapsulation structure. A second integrated circuit is affixed to the first encapsulation structure by use of the adhesive in the groove. A second encapsulation structure at least partially encases the first encapsulation structure, the first integrated circuit, and the second integrated circuit.