Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof

Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly ( 400 ) can comprise a support member ( 410 ) that includes an inner wall ( 412 ) which defines an opening ( 414 ) configured to receive the workpiece and a plurality of contacts ( 420 ). The individual contacts ( 420 ) include a conductor ( 440 ) and a cover ( 430 ). The conductor ( 440 ) can comprise a proximal section ( 435 ) projecting inwardly into the opening ( 414 ) relative to the support member ( 410 ), a distal section ( 436 ) extending from the proximal section ( 435 ), and an inert exterior ( 444 ) at least at the distal section ( 436 ). The cover ( 430 ) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.