Lead frame-based semiconductor device packages incorporating at least one land grid array package

A lead frame-based semiconductor device package including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads on the same side of the interposer substrate as the at least one se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CORISIS DAVID J, LE CHOON KUAN, CHONG CHIN HUI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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