Back grinding methods for fabricating an image sensor

Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the image sensor; grinding a backside of a semiconductor substrate of the image sensor; and removing the profi...

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Bibliographische Detailangaben
1. Verfasser:	JUNG MENG-AN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the image sensor; grinding a backside of a semiconductor substrate of the image sensor; and removing the profile anti-deformation film.