Method and apparatus for monitoring for failure temperatures of a structure

An apparatus for monitoring a temperature of a structure, comprising: one or more electrically conductive loops adapted to be affixed to the structure, each including first and second elongate connection strips each made of a first metal composition having a first melting point, and a temperature se...

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Bibliographische Detailangaben
Hauptverfasser:	CAIN RUSSELL P, LENNON ANDREW M, CARKHUFF BLISS G
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ALARM SYSTEMS CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORDER TELEGRAPHS PAINTS PHYSICS POLISHES SIGNALLING SIGNALLING OR CALLING SYSTEMS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An apparatus for monitoring a temperature of a structure, comprising: one or more electrically conductive loops adapted to be affixed to the structure, each including first and second elongate connection strips each made of a first metal composition having a first melting point, and a temperature sensitive band connected between the first and second connection strips and made of a second metal composition having a second melting point less than the first melting point. The apparatus further comprises a monitor, connected to respective ends of the first and second connection strips spaced-apart from the temperature sensitive band, configured to detect an open-circuit in the one or more electrically conductive loops caused when the temperature sensitive band separates from either of the connection strips.