Metal mask and method of printing lead-free solder paste using same

A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member 6 , and moving a printing squeegee along the upper surface...

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Bibliographische Detailangaben
Hauptverfasser:	KOMAMIZU SHUICHI, MORI TAKAYUKI, MAKINO KAZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTED CIRCUITS PRINTING PRINTING PLATES OR FOILS SOLDERING OR UNSOLDERING STAMPS TRANSPORTING TYPEWRITERS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member 6 , and moving a printing squeegee along the upper surface of the metal mask 1 to thereby print a lead-free solder paste on the surface of the electrode 21 on the circuit board 2 . The method produces on the electrode 21 of the circuit board 2 two lead-free solder paste patterns 30 a , 30 a each circular or elliptical in shape and arranged in a direction in which the lead member 6 is to extend from the electrode.