Peelable circuit board foil

In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer c...

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Bibliographische Detailangaben
Hauptverfasser:	DEAN TIMOTHY B, CHELINI REMY J, DUNN GREGORY J
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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