Peelable circuit board foil

In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil ( 200 ) has a crystallized dielectric oxide layer ( 405 ) disposed on the metal foil layer and an electrode layer ( 415 ) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil ( 400 ) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.