Peelable circuit board foil
In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer c...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | DEAN TIMOTHY B CHELINI REMY J DUNN GREGORY J |
| description | In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil ( 200 ) has a crystallized dielectric oxide layer ( 405 ) disposed on the metal foil layer and an electrode layer ( 415 ) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil ( 400 ) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7241510B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7241510B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7241510B23</originalsourceid><addsrcrecordid>eNrjZJAOSE3NSUzKSVVIzixKLs0sUUjKTyxKUUjLz8zhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmRiaGpoYGTkbGRCgBAB2CIts</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Peelable circuit board foil</title><source>esp@cenet</source><creator>DEAN TIMOTHY B ; CHELINI REMY J ; DUNN GREGORY J</creator><creatorcontrib>DEAN TIMOTHY B ; CHELINI REMY J ; DUNN GREGORY J</creatorcontrib><description>In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil ( 200 ) has a crystallized dielectric oxide layer ( 405 ) disposed on the metal foil layer and an electrode layer ( 415 ) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil ( 400 ) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.</description><language>eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070710&DB=EPODOC&CC=US&NR=7241510B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070710&DB=EPODOC&CC=US&NR=7241510B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DEAN TIMOTHY B</creatorcontrib><creatorcontrib>CHELINI REMY J</creatorcontrib><creatorcontrib>DUNN GREGORY J</creatorcontrib><title>Peelable circuit board foil</title><description>In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil ( 200 ) has a crystallized dielectric oxide layer ( 405 ) disposed on the metal foil layer and an electrode layer ( 415 ) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil ( 400 ) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.</description><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAOSE3NSUzKSVVIzixKLs0sUUjKTyxKUUjLz8zhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmRiaGpoYGTkbGRCgBAB2CIts</recordid><startdate>20070710</startdate><enddate>20070710</enddate><creator>DEAN TIMOTHY B</creator><creator>CHELINI REMY J</creator><creator>DUNN GREGORY J</creator><scope>EVB</scope></search><sort><creationdate>20070710</creationdate><title>Peelable circuit board foil</title><author>DEAN TIMOTHY B ; CHELINI REMY J ; DUNN GREGORY J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7241510B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DEAN TIMOTHY B</creatorcontrib><creatorcontrib>CHELINI REMY J</creatorcontrib><creatorcontrib>DUNN GREGORY J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DEAN TIMOTHY B</au><au>CHELINI REMY J</au><au>DUNN GREGORY J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Peelable circuit board foil</title><date>2007-07-10</date><risdate>2007</risdate><abstract>In one embodiment, a peelable circuit board foil ( 200 ) has a metal support layer ( 205 ) and a conductive metal foil layer ( 210 ) bonded by an inorganic high temperature release structure ( 215 ) that comprises a co-deposited layer ( 250 ) and a metal oxide layer ( 260 ). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil ( 200 ) has a crystallized dielectric oxide layer ( 405 ) disposed on the metal foil layer and an electrode layer ( 415 ) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil ( 400 ) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US7241510B2 |
| source | esp@cenet |
| subjects | LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING |
| title | Peelable circuit board foil |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T02%3A49%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DEAN%20TIMOTHY%20B&rft.date=2007-07-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7241510B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |