Compliant wirebond pedestal

A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of b...

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Hauptverfasser: MARSH JEFFREY W, WHITE R. TRACY, HAMILTON DAVID L
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creator MARSH JEFFREY W
WHITE R. TRACY
HAMILTON DAVID L
description A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7214607B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7214607B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7214607B23</originalsourceid><addsrcrecordid>eNrjZJB2zs8tyMlMzCtRKM8sSk3Kz0tRKEhNSS0uSczhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmRoYmZgbmTkbGRCgBAEtyI10</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Compliant wirebond pedestal</title><source>esp@cenet</source><creator>MARSH JEFFREY W ; WHITE R. TRACY ; HAMILTON DAVID L</creator><creatorcontrib>MARSH JEFFREY W ; WHITE R. TRACY ; HAMILTON DAVID L</creatorcontrib><description>A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070508&amp;DB=EPODOC&amp;CC=US&amp;NR=7214607B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25546,76297</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070508&amp;DB=EPODOC&amp;CC=US&amp;NR=7214607B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARSH JEFFREY W</creatorcontrib><creatorcontrib>WHITE R. TRACY</creatorcontrib><creatorcontrib>HAMILTON DAVID L</creatorcontrib><title>Compliant wirebond pedestal</title><description>A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2zs8tyMlMzCtRKM8sSk3Kz0tRKEhNSS0uSczhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmRoYmZgbmTkbGRCgBAEtyI10</recordid><startdate>20070508</startdate><enddate>20070508</enddate><creator>MARSH JEFFREY W</creator><creator>WHITE R. TRACY</creator><creator>HAMILTON DAVID L</creator><scope>EVB</scope></search><sort><creationdate>20070508</creationdate><title>Compliant wirebond pedestal</title><author>MARSH JEFFREY W ; WHITE R. TRACY ; HAMILTON DAVID L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7214607B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MARSH JEFFREY W</creatorcontrib><creatorcontrib>WHITE R. TRACY</creatorcontrib><creatorcontrib>HAMILTON DAVID L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARSH JEFFREY W</au><au>WHITE R. TRACY</au><au>HAMILTON DAVID L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Compliant wirebond pedestal</title><date>2007-05-08</date><risdate>2007</risdate><abstract>A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Compliant wirebond pedestal
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