Compliant wirebond pedestal
A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of b...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | MARSH JEFFREY W WHITE R. TRACY HAMILTON DAVID L |
description | A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ). |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7214607B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7214607B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7214607B23</originalsourceid><addsrcrecordid>eNrjZJB2zs8tyMlMzCtRKM8sSk3Kz0tRKEhNSS0uSczhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmRoYmZgbmTkbGRCgBAEtyI10</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Compliant wirebond pedestal</title><source>esp@cenet</source><creator>MARSH JEFFREY W ; WHITE R. TRACY ; HAMILTON DAVID L</creator><creatorcontrib>MARSH JEFFREY W ; WHITE R. TRACY ; HAMILTON DAVID L</creatorcontrib><description>A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070508&DB=EPODOC&CC=US&NR=7214607B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25546,76297</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070508&DB=EPODOC&CC=US&NR=7214607B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARSH JEFFREY W</creatorcontrib><creatorcontrib>WHITE R. TRACY</creatorcontrib><creatorcontrib>HAMILTON DAVID L</creatorcontrib><title>Compliant wirebond pedestal</title><description>A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2zs8tyMlMzCtRKM8sSk3Kz0tRKEhNSS0uSczhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmRoYmZgbmTkbGRCgBAEtyI10</recordid><startdate>20070508</startdate><enddate>20070508</enddate><creator>MARSH JEFFREY W</creator><creator>WHITE R. TRACY</creator><creator>HAMILTON DAVID L</creator><scope>EVB</scope></search><sort><creationdate>20070508</creationdate><title>Compliant wirebond pedestal</title><author>MARSH JEFFREY W ; WHITE R. TRACY ; HAMILTON DAVID L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7214607B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MARSH JEFFREY W</creatorcontrib><creatorcontrib>WHITE R. TRACY</creatorcontrib><creatorcontrib>HAMILTON DAVID L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARSH JEFFREY W</au><au>WHITE R. TRACY</au><au>HAMILTON DAVID L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Compliant wirebond pedestal</title><date>2007-05-08</date><risdate>2007</risdate><abstract>A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US7214607B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WELDING WORKING BY LASER BEAM |
title | Compliant wirebond pedestal |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T09%3A26%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MARSH%20JEFFREY%20W&rft.date=2007-05-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7214607B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |