Compliant wirebond pedestal

A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of b...

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Bibliographische Detailangaben
Hauptverfasser:	MARSH JEFFREY W, WHITE R. TRACY, HAMILTON DAVID L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A wire bonder ( 900 ) with a rigid pedestal ( 902 ) having resilient inserts ( 920 ). A package ( 904 ) placed on the pedestal ( 902 ) contains an electrical device ( 906 ). The bond pads on the electrical device ( 906 ) are electrically connected to bond pads on the package ( 904 ) by a series of bond wires ( 908 ) through use of a well know bonding process. A vacuum source holds the package ( 904 ) against the pedestal ( 902 ) deforming the resilient strips ( 920 ) located in the rigid member ( 902 ) of the pedestal and ensuring good contact between the ground pads of the package ( 904 ) and conductive resilient members ( 920 ). The resilient members ( 920 ) are conductive and electrically connect the package grounds to a system ground ( 922 ).