Method for encapsulating a plurality of electronic components

A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BAUER KLAUS, AUBURGER BERNHARD, HENZINGER RONALD, JAEGER WIGHARD, LEIDERER HERMANN, RUBEY ARMIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In particular, the coating can be accomplished by immersion. The electronic component includes the coating encapsulation of a coating material applied in a flowable condition and hardened and a plastic encapsulation encapsulating the coating.