Circuit tape having adhesive film semiconductor device and a method for manufacturing the same

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the moun...

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Bibliographische Detailangaben
Hauptverfasser:	MITA MAMORU, KITANO MAKOTO, OGINO MASAHIKO, SEGAWA MASANORI, KOKAKU HIROYOSHI, ANJOH ICHIRO, NAGAI AKIRA, MIYAZAKI CHUICHI, ISHII TOSHIAK, MORISHIMA MAKOTO, OKABE NORIO, EGUCHI SHUJI, TSUYUNO NOBUTAKE, TSUBOSAKI KUNIHIRO, HATTORI RIE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).