Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.

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Bibliographische Detailangaben
Hauptverfasser: MENEZES SUSANNE, SUH DOOWON, DATTA MADHAV, EMORY DAVE, JOSHI SUBHASH M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device.