Radiant energy heating for die attach
Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
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| Format: | Patent |
| Sprache: | eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described. |
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