Electronic circuit device and its manufacturing method

It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1 , surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circuit pattern 2 , connecting member 3 formed from conductive res...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIKAWA KAZUHIRO, OKANO MASAYUKI, TSUKAHARA NORIHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1 , surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circuit pattern 2 , connecting member 3 formed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesive 6 for bonding the electronic components 30, 40 and circuit board 10 , which is lower in curing temperature than conductive resin paste and disposed in a space between circuit board 10 and electronic components 30, 40 between connecting regions.