Streamlined IC mask layout optical and process correction through correction reuse

An EDA tool is provided with an OPC module that performs optical and/or process pre-compensations on an IC mask layout in a streamlined manner, reusing determined corrections for a first area on a second area, when the second area is determined to be equivalent to the first area for OPC purposes. Th...

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Bibliographische Detailangaben
1. Verfasser:	COBB NICOLAS B
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An EDA tool is provided with an OPC module that performs optical and/or process pre-compensations on an IC mask layout in a streamlined manner, reusing determined corrections for a first area on a second area, when the second area is determined to be equivalent to the first area for OPC purposes. The OPC module performs the correction on the IC mask layout on an area-by-area basis, and the corrections are determined iteratively using model-based simulations, which in one embodiment, include resist model-based simulations as well as optical model-based simulations.