Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method

A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be proces...

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Bibliographische Detailangaben
Hauptverfasser: MIYAKAWA TAKUYA, MORI YOSHIAKI, SATO MITSURU, ASUKE SHINTARO, TAKAGI KENICHI
Format: Patent
Sprache:eng
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Zusammenfassung:A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.