Diamond like carbon silicon on insulator substrates and methods of fabrication thereof

Diamond like carbon silicon on insulator substrates and methods of fabrication thereof are disclosed. In one form, a process for creating a composite structure for fabricating an electronic device is disclosed. The process includes forming a first diamond-like carbon layer on a substrate and couplin...

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Bibliographische Detailangaben
Hauptverfasser: STALLINGS PATRICK L, BARNES WILLIAM C, RAMAN SANKAR N
Format: Patent
Sprache:eng
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Zusammenfassung:Diamond like carbon silicon on insulator substrates and methods of fabrication thereof are disclosed. In one form, a process for creating a composite structure for fabricating an electronic device is disclosed. The process includes forming a first diamond-like carbon layer on a substrate and coupling a support layer to the diamond-like carbon layer. The substrate is reduced to provide a device layer for fabricating a microelectronic device.