Method for surface treatment of polymeric substrates

Methods for treating polymeric substrates by placing the substrate in a gaseous mixture and subjecting it to a dielectric barrier electrical discharge. The gaseous mixture, which has a pressure around atmospheric, contains a carrier gas, a reducing gas and an oxidizing gas. The amount of the oxidizi...

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Hauptverfasser:	COEURET FRANCOIS, GELOT JEAN-LOUIS, PRINZ ECKHARD, VILLERMET ALAIN, COCOLIOS PANAYOTIS, FORSTER FRANCK, RAMES-LANGLADE GERALDINE, MARTENS BERND
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY COMPOSITIONS BASED THEREON FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR GENERAL PROCESSES OF COMPOUNDING LAUNDERING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TEXTILES THEIR PREPARATION OR CHEMICAL WORKING-UP THEIR RELEVANT APPARATUS TRANSPORTING TREATMENT OF TEXTILES OR THE LIKE TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	Methods for treating polymeric substrates by placing the substrate in a gaseous mixture and subjecting it to a dielectric barrier electrical discharge. The gaseous mixture, which has a pressure around atmospheric, contains a carrier gas, a reducing gas and an oxidizing gas. The amount of the oxidizing gas in the gas mixture is between about 50 ppm and about 2000 ppm by volume, while the amount of the reducing gas in the gas mixture is between about 50 ppm and 30000 ppm by volume.