Temperature dependent semiconductor module connectors

Temperature dependent semiconductor module connectors

A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subj...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUSKO ROBIN A, BRODSKY WILLIAM L, CHAMBERLIN BRUCE J, FERRILL MITCHELL G, WILCOX JAMES R, BUSBY JAMES A
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Beschreibung
Zusammenfassung:A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.