Passive millimeter wave sensor using high temperature superconducting leads

A radiation sensor ( 20 ) has a substrate ( 34 ); an antenna ( 24 ) coupled to the substrate ( 34 ), a thermal detector unit TDU ( 22 ) spaced from the antenna ( 24 ) and the substrate ( 34 ); and a multi-layered conductive lead ( 30 ). The conductive lead ( 30 ) physically contacts the antenna ( 24...

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Bibliographische Detailangaben
Hauptverfasser: GORDON ELI E, JACK MICHAEL D
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A radiation sensor ( 20 ) has a substrate ( 34 ); an antenna ( 24 ) coupled to the substrate ( 34 ), a thermal detector unit TDU ( 22 ) spaced from the antenna ( 24 ) and the substrate ( 34 ); and a multi-layered conductive lead ( 30 ). The conductive lead ( 30 ) physically contacts the antenna ( 24 ) and the TDU ( 22 ). The conductive lead ( 30 ) defines a support layer ( 44 ) adjacent to the substrate ( 34 ) for structurally supporting the TDU ( 22 ) over a cavity defined by the substrate ( 34 ), a buffer layer ( 46 ) disposed on the support layer ( 44 ), and a superconductive layer ( 48 ) disposed on the buffer layer ( 46 ). The buffer layer has a crystalline structure to facilitate bonding with other layers. A method for making the sensor ( 20 ) is disclosed wherein the superconductive layer ( 48 ) and the buffer layer ( 46 ) are deposited using laser deposit, the buffer layer ( 46 ) with ion beam assist for alignment.