Heat dissipating device

A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink ( 10 ) and a fan ( 30 ) generating airflow. The heat sink has a base ( 11 ) and a plurality of first fins ( 13 ) extending therefrom. First airflow channels ( 132 ) are de...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DONG SHUN CHI, HUANG AIMIN, WANG YAXIONG, HUANG CHUNG-YUAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink ( 10 ) and a fan ( 30 ) generating airflow. The heat sink has a base ( 11 ) and a plurality of first fins ( 13 ) extending therefrom. First airflow channels ( 132 ) are defined between the first fins. A plurality of second fins ( 15 ) are transversely attached to the first fins. The second fins have second airflow channels ( 152 ) defined therebetween. The second airflow channels communicate with the first airflow channels.