Heat sink for enhanced heat dissipation

A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat pipe) extends through a substantial portion of the block. In one example arrangement, airflow channels e...

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Bibliographische Detailangaben
Hauptverfasser: MULLER P. KEITH, WANG DAVID G
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat pipe) extends through a substantial portion of the block. In one example arrangement, airflow channels extend through portions of the block.