Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
A semiconductor device is arranged so as to include (i) a wire L 1 , connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB 1 connected not directly to but to one of a pair of electrodes of a capacitor provided between the wire L...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A semiconductor device is arranged so as to include (i) a wire L 1 , connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB 1 connected not directly to but to one of a pair of electrodes of a capacitor provided between the wire LB 1 and a voltage VGH wire, each of the wire L 1 and the wire LB 1 including a voltage input terminal. This arrangement provides (i) a semiconductor device, including a built-in capacitor, which makes it possible to shorten time required in an electrical screening test (final test) so as to reduce cost, and (ii) an electrical inspection method of the semiconductor device. |
---|