Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device

A semiconductor device is arranged so as to include (i) a wire L 1 , connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB 1 connected not directly to but to one of a pair of electrodes of a capacitor provided between the wire L...

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Hauptverfasser: EGAWA ICHIRO, ORISAKA YUKIHISA
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device is arranged so as to include (i) a wire L 1 , connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB 1 connected not directly to but to one of a pair of electrodes of a capacitor provided between the wire LB 1 and a voltage VGH wire, each of the wire L 1 and the wire LB 1 including a voltage input terminal. This arrangement provides (i) a semiconductor device, including a built-in capacitor, which makes it possible to shorten time required in an electrical screening test (final test) so as to reduce cost, and (ii) an electrical inspection method of the semiconductor device.