Printed circuit board with isolated metallic substrate comprising an integrated cooling system

Printed circuit board with insulated metal substrate with integrated cooling systemlt comprises a metal substrate ( 10 ), at least one electrically insulating layer ( 11 ) adhered to said metal substrate ( 10 ) and several electro-conducting tracks ( 12 ) capable of interconnecting electronic power components ( 24 ), adhered to said electrically insulating layer ( 11 ), said metal substrate ( 10 ) incorporating several heat transporting channels comprising several conduits for a heat-carrying fluid, conduits which extend to the outside of the metal substrate up to a heat transfer area to an outside medium.