High density package with wrap around interconnect
A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect i...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect is disposed around an outer surface of the substrate piece. |
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