Memory package

A memory package comprising a first circuit board having a plurality of memory element sockets and a second circuit board coupled to the first circuit board and comprising a controller chip. The first and second circuit boards are disposed within a tray having a base and two sides. A handle is conne...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MEGASON GEORGE D, MANWEILER KURT A, HARDT THOMAS T
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A memory package comprising a first circuit board having a plurality of memory element sockets and a second circuit board coupled to the first circuit board and comprising a controller chip. The first and second circuit boards are disposed within a tray having a base and two sides. A handle is connected to the tray such that the handle is pivotal with respect to the tray. The handle has a lever system and latch that is slidably engaged with the lever system.