Polishing solution and method of polishing nonferrous metal materials

A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribut...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUKUI HIROKAZU, SUZUKI YOUICHIRO, TSUCHIYA KAZUYO, ARITA SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform.