Fluidic cooling systems and methods for electronic components

A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic compone...

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Bibliographische Detailangaben
Hauptverfasser:	OSTRANDER STEVEN P, DAVES GLENN G, FURMAN BRUCE K, POMPEO FRANK L, TOY HILTON T, SHIH DA-YUAN, WILLIAMSON JAIMAL M, GAYNES MICHAEL A, HENDERSON DONALD W, KANG SUNG K, COLGAN EVAN G, EDWARDS DAVID L, FAROOQ MUKTA G
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.