Chemically assisted mechanical cleaning of MRAM structures
A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced...
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creator | RAVKIN MICHAEL MIKHAYLICHENKO KATRINA |
description | A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry. |
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The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry.</description><language>eng</language><subject>CLEANING ; CLEANING IN GENERAL ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060627&DB=EPODOC&CC=US&NR=7067016B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060627&DB=EPODOC&CC=US&NR=7067016B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAVKIN MICHAEL</creatorcontrib><creatorcontrib>MIKHAYLICHENKO KATRINA</creatorcontrib><title>Chemically assisted mechanical cleaning of MRAM structures</title><description>A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry.</description><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLByzkjNzUxOzMmpVEgsLs4sLklNUchNTc5IzAOJKiTnpAJZeekK-WkKvkGOvgrFJUWlySWlRanFPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7UkPjTY3MDM3MDQzMnQmAglABbkLq4</recordid><startdate>20060627</startdate><enddate>20060627</enddate><creator>RAVKIN MICHAEL</creator><creator>MIKHAYLICHENKO KATRINA</creator><scope>EVB</scope></search><sort><creationdate>20060627</creationdate><title>Chemically assisted mechanical cleaning of MRAM structures</title><author>RAVKIN MICHAEL ; MIKHAYLICHENKO KATRINA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7067016B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>RAVKIN MICHAEL</creatorcontrib><creatorcontrib>MIKHAYLICHENKO KATRINA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAVKIN MICHAEL</au><au>MIKHAYLICHENKO KATRINA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chemically assisted mechanical cleaning of MRAM structures</title><date>2006-06-27</date><risdate>2006</risdate><abstract>A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CLEANING CLEANING IN GENERAL PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL TRANSPORTING |
title | Chemically assisted mechanical cleaning of MRAM structures |
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