Thin film magnetic head
A magnetic material having a low coefficient of thermal expansion of 11.5x10-6/K or less is used for forming at least one of a lower shield or an upper shield. A laminated film comprising a layer of the magnetic material having a low coefficient of thermal expansion of 11.5x10-6/K or less, and an 80...
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Zusammenfassung: | A magnetic material having a low coefficient of thermal expansion of 11.5x10-6/K or less is used for forming at least one of a lower shield or an upper shield. A laminated film comprising a layer of the magnetic material having a low coefficient of thermal expansion of 11.5x10-6/K or less, and an 80 wt % NiFe alloy layer, is used for forming at least one of the lower shield and the upper shield. Thus, the thin film magnetic head having reduced after-record noise and reduced thermal protrusion can be obtained. |
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